Editorial Board


OJ-NANO Editorial Board

Wen Jung LI

City University of Hong Kong, Hong Kong SAR, China

Wen Jung LI was educated at the University of Southern California (BS Aerospace Engineering ‘87; MS Aerospace Engineering ‘89) and the University of California, Los Angeles (PhD ‘97, Aerospace Engineering). He is currently a Chair Professor in the Dept. of Mechanical Engineering and concurrently serving as Associate Provost (Institutional Initiatives) of the City University of Hong Kong (CityU). Prior to joining CityU, he was with the Dept. of Mechanical and Automation Engineering of The Chinese University of Hong Kong (CUHK) from 1997 to 2011. His academic honors include IEEE Fellow, ASME Fellow, 100 Talents of the Chinese Academy of Sciences (中科院百人計劃), and 1000 Talents of Zhejiang Province (浙江省千人計劃). He served as the President of the IEEE Nanotechnology Council in 2016 and 2017 and has been appointed as the Editor-in-Chief of the new IEEE Open Journal on Nanotechnology. Before joining CUHK in 1997, he held R&D positions at the NASA/Caltech Jet Propulsion Laboratory (Pasadena, CA), The Aerospace Corporation (El Segundo, CA), and at Silicon Microstructures Inc. (Fremont, CA). Since 1997, his research group has published more than 300 technical papers related to MEMS, Nanotechnology, and Robotics, including papers in Nature Communications, Nature Methods, Advanced Functional Materials, IEEE/ASME J. MEMS, and IEEE Trans. on Nanotechnology. His current research interest includes BioMEMS, intelligent cyber physical sensors, and super-resolution microscopy.
Jin-Woo KIM
Associate Editor-in-Chief

University of Arkansas, USA

Jin-Woo Kim is a Director of Bio/Nano Technology Group and a Professor of Biological Engineering, Biomedical Engineering and Nanoscience & Engineering at University of Arkansas. He is an Adjunct Professor of Electrical Engineering at Pohang University of Science & Technology (POSTECH). He received his first B.S. in Chemical Technology (currently Chemical & Biological Engineering) from Seoul National University, the second B.S. in Microbiology from University of Iowa, the M.S. in Biology from University of Wisconsin, and the Ph.D. in Biological Engineering from Texas A&M University. He was a Visiting Professor of the School of Engineering and Applied Sciences at Harvard University, the Center for Functional Nanomaterials at Brookhaven National Laboratory, and Nano-THz Photonics National Research Laboratory at POSTECH. His research focus is in the area of Bio/Nano Technology, i.e., biologically inspired nanotechnology, which spans interdisciplinary fields of biological engineering, biomedical engineering, biology, chemistry, and nanotechnology. Learning from biological systems in nature, his research aims to develop more effective and efficient routes to “panoscale” (i.e., ‘any’ scale) system integration of multifunctional hierarchical structures for biomimetic advanced materials and devices. He has published over 120 peer-reviewed articles, including those in Nature Nanotechnology, Angewandte Chemie International Edition, Nanoscale, Advanced Healthcare Materials, Nanomedicine, Applied Physics Letters, IEEE Trans. on Nanotechnology, IEEE Trans. on Nanobioscience, etc. He received several teaching and research awards, holds guest editorships and journal editorial board memberships for several journals, including co-Editor-in-Chief of IEEE Open Journal of Nanotechnology, and has been ad-hoc reviewers for leading journals, including Science, PNAS, and Nature Nanotechnology. He held leadership positions for international societies, including Vice President for Publications of IEEE Nanotechnology Council (2017-2019), is a steering committee chair of IEEE International Conference on Nano/Molecular Medicine and Engineering (IEEE-NANOMED), and has served as organizing committees for several international conferences, including general chairs (2015 and 2019), general co-chairs (2011 and 2017) and program chair (2010) of IEEE-NANOMED, general co-chair (2019) of IEEE International Conference on Nanotechnology (IEEE-NANO), general chair (2020) of IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE-NEMS), etc. He is a Fellow of the American Institute for Medical & Biological Engineering (AIMBE) and IEEE Nanotechnology Distinguished Lecturer (2017-2018).
Associate Editor-in-Chief

Tohoku University, Japan

Samukawa joined NEC in 1981 after graduating in Instrumentation Engineering from Keio University. Worked on the research and development of ultra-precise plasma etching processes for ULSI devices. Promoted to Principal Researcher in Microelectronics Laboratory, R&D Group NEC Corporation. Obtained a Ph.D. in Instrumentation Engineering from Keio University in 1992. Prof Samukawa, early in his career at NEC in Japan, recognized the importance of developing plasma processing technologies that mitigated process related device damage. His first major contribution addressed the requirement for ultralow plasma potentials and electron temperatures along with superior species flux uniformity to reduce damage. This contribution foretold the emergence of what is today’s ultrahigh frequency plasma sources, capacitively coupled VHF and microwave-based that are critical for damage-free plasma processing. Since July 2000, he has been a full professor at Tohoku University, an institution renowned for contributions to damage-free process and leading edge device technology, where he is currently Director of the Innovative Energy Research Center at the Institute of Fluid Science (IFS) Tohoku University. He is also a Principal Investigator (PI) at Advanced Institute of Materials Research (AIMR) Tohoku university, deputy director of Material Solutions Center (MaSC) Tohoku university, Joint appointment Fellow of National instituite of advanced industrial science and technology (AIST) and also Chair Professor of National Chiao Tung University (Taiwan). The trend in research at the time was the manipulation of plasmas using magnetic fields, negative ion extraction to minimize the impact of charge imbalances in features and energetic species on devices. Prof. Samukawa, rather than rushing into the fray, took a careful diagnostics-based approach. He first characterized the impact of different kinds of radiation on the device results. New plasma pulsing technology was matched to the core issues he identified. His original patents for plasma pulsing technology are key references for much of the patented plasma pulse technology that has followed. Pulse-time-modulated plasma etching and nitridation systems have been widely introduced into mass-production lines for sub-90 nm generation devices. Now, 50 percent of all plasma etch systems include pulse-modulated plasma functions. According to the latest information, going forward pulse-modulated plasma associated technologies are expected generate nearly a few billions $ in revenue per year. Always ahead of the curve, in 2000, Prof. Samukawa demonstrated damage-free top-down etching using a newly developed neutral beam etching system. Neutral beam etching is the ultimate goal for nanofabrication to achieve charge-free and UV photon irradiation damage-free processes. He was the first to demonstrate that neutral beams can be efficiently generated by the acceleration of negative ions in pulsed plasmas followed by their neutralization. With this method, he generated high-density, low-energy neutral beams with neither charged particles nor UV photons incident onto the substrate surface; and demonstrated damage-free etching, oxidation and deposition for sub-22 nm Si fin-FETs, damage-free etching and oxidation for sub-10nm Ge fin-FETs, and damage-free gate recess etching for high-frequency noise performance of Al2O3/AlGaN/GaN MOS HEMT. Combining biotechnology with neutral-beam-based nano-processes, i.e., bio-nano templating processes, he fabricated sub-10 nm diameter and high-density nano-disk array structures (Si, InGaAs, InGaN and 2D materials). The quantum effects of these structures were demonstrated at room temperature due to the damage-free etched surfaces made possible by neutral beam etching. Also relying on Si and InGaN nano-disk structures, he is developing quantum dot (QD) solar cells with high energy conversion efficiencies of more than 45% and QD Green LED with high internal quantum efficiencies. His significant scientific achievements earned him Ichimura Award (2008) in the New Technology Development Foundation, Prizes for Science and Technology; The Commendation for Science and Technology by the Minister of Education, Culture, Sports, Science and Technology (2009), Plasma Prize in American Vacuum Society (2010) and IEEE NTC Distinguished Lecturers (2019). Additionally, he has been elected as a “Distinguished Professor” of Tohoku University, a “Fellow” of the Japan Society of Applied Physics (JSAP) since 2008, a “Fellow” of American Vacuum Society (AVS) since 2009 and a also “Fellow” of Institute of Electrical and Electronics Engineers (IEEE) since 2018.

International Editorial Board

Prof. Hui-Ming CHENGProfessor, Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Beijing, China
Dr. Kazuhiko ENDONanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology, Ibaraki, Japan
Prof. Toshio FUKUDASchool of Mechatronical Engineering, Beijing Institute of Technology, China / Meijo University, Japan
Prof. Oleg GANGDepartment of Chemical Engineering, Fu Foundation School of Engineering and Applied Science, Columbia University, New York, USA
Prof. Alex Kwan-Yue JENChair Professor, Department of Materials Science and Engineering and Department of Chemistry, City University of Hong Kong, Hong Kong SAR, China
Prof. Yoshiaki KANAMORIDepartment of Robotics, Graduate School of Engineering, Tohoku University, Miyagi, Japan
Prof. Vincent Gwo-Bin LEEDirector, Institute of Biomedical Engineering, National Tsing Hua University, Taiwan
Prof. Fabrizio LOMBARDIDepartment of Electrical and Computer Engineering, Northeastern University, Boston, USA
Prof. Paolo LUGLIRector and Professor, Free University of Bozen-Bolzano, Bolzano, Italy
Prof. Kevin Kit PARKERHarvard John A.Paulson School of Engineering and Applied Science, Harvard University, Massachusetts, USA
Prof. Masaharu SHIRATANIDepartment of Electronics, Faculty of Information Science and Electrical Engineering, Kyushu University, Fukuoka, Japan
Prof. Yu SUNUniversity of Toronto, Ontario, Canada
Prof. Masaki TANEMURADepartment of Physical Science and Engineering, Graduate School of Engineering, Nagoya Institute of Technology, Aichi, Japan
Prof. Zhong Lin WANGHightower Chair, Materials Science and Engineering and Regents’ Professor, Georgia Institute of Technology, Georgia, USA
Prof. Paul WEISSDistinguished Professor of California NanoSystems Institute and Departments of Chemistry & Biochemistry and Materials Science & Engineering, University of California, Los Angeles, USA
Prof. Ichiro YAMASHITAGraduate School of Engineering, Osaka University, Osaka, Japan

Associate Editors

Associate Prof. Mahmoud ALMASRIDepartment of Electrical Engineering and Computer Science, University of Missouri, Missouri, USA
Associate Prof. Masayoshi ARITAGraduate School of Information Science and Technology, Hokkaido University, Hokkaido, Japan
Associate Prof. Chang-Ki BAEKAssociate Professor in Department of Creative IT Engineering (CiTE) and Electrical Engineering (EE) in Pohang University of Science & Technology (POSTECH), Gyeongsangbuk-do, Korea
Dr. Parthasarathi CHAKRABORTIProcess Engineer, Intel Corporation, Oregon, USA
Prof. Lixin DONGDepartment of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China
Prof. Atsuhiko FUKUYAMADepartment of Electronic Physics, Miyazaki University, Miyazaki, Japan
Associate Prof. Kalita GOLAPDepartment of Physical Science and Engineering, Nagoya Institute of Technology, Aichi, Japan
Prof. Jr-Hau HE
Prof. Henry HESSBiomedical Engineering, Columbia University, New York, USA
Assistant Prof. Akio HIGOReserch Center for Advanced Science and Technology, The University of Tokyo, Tokyo, Japan
Prof. Xiaoning JIANGDepartment of Mechanical and Aerospace Engineering, North Carolina State University, North Carolina, USA
Associate Prof. Do-Nyun KIMMechanical Engineering, Seoul National University, Korea
Associate Prof. Kazunori KOGADepartment of Electronics, Kyushu University, Fukuoka, Japan
Prof. Lianqing LIUShenyang Institute of Automation, the Chinese Academy of Sciences, Shenyang, China
Prof. Jinshui MIAOShanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China
Associate Prof. Masahiro NOMURAElectron/Phonon Band Engineering, The University of Tokyo, Tokyo, Japan
Prof. Shinichiro NOMURADivision of Mechanical Engineering, Tohoku University, Sendai, Japan
Associate Prof. Takeo OHNOGraduate School of Engineering, Oita University, Oita, Japan
Prof. Aaron T. OHTADepartment of Electrical Engineering, University of Hawaii at Manoa, Hawaii, USA
Associate Prof. Takeru OKADADepartment of Electronic Engineering, Tohoku University, Sendai, Japan
Prof. Inkyu PARKDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Korea
Prof. Markondeya Raj PULUGURTHABiomedical Engineering and Electrical & Computer Engineering, Florida International University, Miami, USA
Dr. Agnes PURWIDYANTRIResearch Fellow, International Iberian Nanotechnology Laboratory, Portugal
Associate Prof. Masaya TODADepartment of Mechanical Systems Engineering, Graduate School of Engineering, Tohoku University, Miyagi, Japan
Prof. Pak Kin WONGBiomedical Engineering, Mechanical Engineering and Surgery, Pennsylvania State Univ., USA
Dr. Jie XUAssistant Scientist, Argonne National Laboratory, USA
Prof. Sheng XUDepartment of NanoEngineering, University of California, San Diego, USA
Dr. Atsushi YAMAMOTOResearch Institute for Energy Conservation, AIST, Ibaraki, Japan
Prof. Da-Jeng YAODepartment of Power Mechanical Engineering, Institute of NanoEngineering and MicroSystems (NEMS) and Department of Engineering and System Science, National Tsing Hua University, Taiwan
Prof. John YEOWUniversity Research Chair, Systems Design Engineering, Waterloo, Canada
Prof. Xinge YUDepartment of Biomedical Engineering, City University of Hong Kong, Hong Kong SAR, China
Prof. Xin ZHAOCollege of Computer and Control Engineering, Nankai University, China
Dr. Yunlong ZIDepartment of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong SAR, China